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US Patent Issued to QUAN MEI TECHNOLOGY on July 7 for "Circuit board, electronic device having the circuit board and method of manufacturing the electronic device" (Taiwanese Inventor)

ALEXANDRIA, Va., July 7 -- United States Patent no. 12,677,372, issued on July 7, was assigned to QUAN MEI TECHNOLOGY Co. LTD. (Kaohsiung City, Taiwan). "Circuit board, electronic device having the c... Read More


US Patent Issued to VIVO MOBILE COMMUNICATION on July 7 for "Circuit board assembly, circuit board stack structure, and electronic device" (Chinese Inventor)

ALEXANDRIA, Va., July 7 -- United States Patent no. 12,677,373, issued on July 7, was assigned to VIVO MOBILE COMMUNICATION Co. LTD. (Guangdong, China). "Circuit board assembly, circuit board stack s... Read More


US Patent Issued to LG ENERGY SOLUTION on July 7 for "Protection circuit unit and method of bonding lead portions and protection circuit unit" (South Korean Inventors)

ALEXANDRIA, Va., July 7 -- United States Patent no. 12,677,374, issued on July 7, was assigned to LG ENERGY SOLUTION LTD. (Seoul, South Korea). "Protection circuit unit and method of bonding lead por... Read More


US Patent Issued to Intel on July 7 for "Stepped package and recessed circuit board" (Malaysian, American Inventors)

ALEXANDRIA, Va., July 7 -- United States Patent no. 12,677,375, issued on July 7, was assigned to Intel Corp. (Santa Clara, Calif.). "Stepped package and recessed circuit board" was invented by Marti... Read More


US Patent Issued to DEXERIALS on July 7 for "Adhesive composition, thermosetting adhesive sheet, and printed wiring board" (Japanese Inventors)

ALEXANDRIA, Va., July 7 -- United States Patent no. 12,677,376, issued on July 7, was assigned to DEXERIALS Corp. (Shimotsuke, Japan). "Adhesive composition, thermosetting adhesive sheet, and printed... Read More


US Patent Issued to Rockwell Collins on July 7 for "Methods for promoting selective copper foil adhesion in a printed circuit board" (Iowa Inventors)

ALEXANDRIA, Va., July 7 -- United States Patent no. 12,677,377, issued on July 7, was assigned to Rockwell Collins Inc. (Cedar Rapids, Iowa). "Methods for promoting selective copper foil adhesion in ... Read More


US Patent Issued to Skyworks Solutions on July 7 for "Apparatus and methods for tool mark free stitch bonding" (Mexican Inventor)

ALEXANDRIA, Va., July 7 -- United States Patent no. 12,677,378, issued on July 7, was assigned to Skyworks Solutions Inc. (Irvine, Calif.). "Apparatus and methods for tool mark free stitch bonding" w... Read More


US Patent Issued to Hella on July 7 for "Latching system for establishing a latching connection between a printed circuit board and an edge-contact plug, printed circuit board, edge- contact plug and add-on part" (German Inventor)

ALEXANDRIA, Va., July 7 -- United States Patent no. 12,677,379, issued on July 7, was assigned to Hella GmbH & Co. KGaA (Lippstadt, Germany). "Latching system for establishing a latching connection b... Read More


US Patent Issued to MELLANOX TECHNOLOGIES on July 7 for "Removable lid for flip chip-ball grid array (FC-BGA) packages" (Israeli Inventors)

ALEXANDRIA, Va., July 7 -- United States Patent no. 12,677,380, issued on July 7, was assigned to MELLANOX TECHNOLOGIES LTD. (Yokneam, Israel). "Removable lid for flip chip-ball grid array (FC-BGA) p... Read More


US Patent Issued to Avary Holding (Shenzhen) Co. Ltd., QING DING PRECISION ELECTRONICS (HUAIAN) on July 7 for "Circuit board" (Chinese, Taiwanese Inventors)

ALEXANDRIA, Va., July 7 -- United States Patent no. 12,677,381, issued on July 7, was assigned to Avary Holding (Shenzhen) Co. Ltd. (Shenzhen, China) and QING DING PRECISION ELECTRONICS (HUAIAN) Co. L... Read More